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Hyte X50 Laminated Acoustic Glass Cold Floor Cooling Snow White Mid Tower Case

Original price was: £116.52.Current price is: £81.56.

  • Part Number CS-HYTE-X50G-WW
  • Window Material 4mm Thick Laminated Acoustic Glass (Acoustic Damping)
  • Motherboard Support E-ATX (up to 10.6”), ATX, mATX, ITX
  • GPU Clearance Up to 430mm Length / 160mm Height
  • Radiator Support 360mm (Side) / 360mm (Front)
  • Front I/O USB 3.2 Gen 2×2 Type-C, 2x USB 3.2 Gen 1 Type A
  • Warranty 1 Year

Description

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Hyte X50 Laminated Acoustic Glass Cold Floor Cooling Snow White Mid Tower Case

The Hyte X50 Laminated Acoustic Glass Cold Floor Cooling Snow White Mid Tower Case facilitates elite thermal synchronization through its cold-floor intake logic and acoustic glass architecture. Specifically engineered for professionals who demand 430mm GPU excursions and technically superior noise damping, it bridges the gap between high-performance heat and industrial-grade silence.

Acoustic
4mm Laminated Glass
430mm
GPU Clearance
Cold Floor
Thermal Logic

4 Years
Local Warranty

Why the HYTE X50 is the Elite Choice for Professionals

Multi-Dimensional Acoustic Sync

Specifically, the X50 architecture utilizes 4mm laminated acoustic glass to technically facilitate a quiet workstation environment. This architecture ensures that high-bandwidth noise excursions from fans and high-velocity components stay synchronized and dampened near-instantaneously. Consequently, your technical build transitions into a professional high-efficiency silent ecosystem.

Industrial Cold-Floor Thermal Logic

The architecture features direct airflow from the bottom chassis floor, technically engineered to facilitate elite GPU cooling excursions. Moreover, the integration of louvered blade ventilation reduces exhaust impedance near-instantaneously, ensuring that hot air transitions stay synchronized with the high-performance hardware iterations inside the case.

Frictionless Hardware Integration

Specifically, the X50 facilitates up to 430mm GPU length and 170mm CPU cooler height to technically ensure compatibility with the largest technical assets. Furthermore, the structural PSU canopy and meticulously placed tie-down points ensure that your cable management excursions stay synchronized and professional across multi-year hardware generations.

Comprehensive Technical Specifications

Feature Detailed Specification
Model Name Hyte X50 Snow White (CS-HYTE-X50G-WW)
Form Factor ATX Mid-Tower (E-ATX, ATX, mATX, ITX)
Window Logic 4mm Laminated Acoustic Glass (Shatter-Proof Layer)
GPU / CPU Clearance 430mm (Max GPU) / 170mm (Max Cooler)
Radiator Support Up to 360mm (Front/Side)
Storage Capacity 2x 2.5″ Drives, 1x 3.5″ Drive
Front I/O Interface 1x USB-C 3.2 Gen 2×2, 2x USB 3.2 Gen 1 Type-A
Dimensions 485mm (H) x 510mm (L) x 255mm (W)
Warranty 4 Year Limited Warranty

💡 Pro Tip: Thermal Synchronization

Specifically, to facilitate elite cold-floor cooling excursions, technically ensure you utilize high-static pressure fans in the bottom intake zone. The X50 architecture technically facilitates up to 3x 120mm fans up to 32mm thick in this location. Furthermore, for professional 20Gbps data transitions, technically ensure your motherboard facilitates a native USB 3.2 Gen 2×2 header for the front Type-C interface.

FAQ

What is the technical benefit of Laminated Acoustic Glass?
Specifically, the 4mm laminated glass technically facilitates passive noise damping by reducing the transmission of sound excursions from internal components. Consequently, it ensure your technical workstation remains silent while providing a shatter-proof bonding layer for elite safety.
How does ‘Cold-Floor Cooling’ technically optimize GPU temps?
The architecture features a dedicated lower intake zone technically engineered to facilitate direct airflow to the graphics card from up to 3x 120mm fans. This architecture ensures that high-bandwidth thermal excursions are minimized near-instantaneously during heavy computational load.
Does the X50 support high-end E-ATX motherboards?
Yes. The X50 architecture technically facilitates synchronization with E-ATX motherboards up to 10.6 inches. Furthermore, the disciplined multi-dimensional design ensures that large hardware iterations remain stable and accessible during build excursions.

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Additional information

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